A series of organosilicon modified epoxy monoacrylates (OMEMA) containing both C=C (UV-curable groups) and epoxy (heat-curable groups) were synthesized, and a number of UV-heat curable systems were prepared. The influence of the length of the organosilicon segment on the gel content, water absorption, mechanical, volume shrinkage and thermal characterizations of UV-heat cured films using modified epoxy monoacrylates as resins were measured. Compared to the epoxy monoacrylates (EMA), UV-heat curable systems with the same active diluents, the gel contents of UV-heat cured films of OMEMA systems were about 97% and was similar to the EMA systems. Its breaking strength decreased. However, the relative elongation UV-heat cured films of OMEMA systems increased from 4.8% to 14.1%, and volume shrinkage was decreased from 6.19% to 4.93%. The decomposition temperature of UV-heat cured films was increased.Cited